Metalized BOPET ReadyLam.
Metalized BOPET ReadyLam designed for HP Indigo digital flexible-packaging workflows, combining reflective barrier performance with enhanced bonding, dependable converting, and fast post-lamination turnaround.
Metalized BOPET ReadyLam
Reflective metalized BOPET construction for digitally printed flexible packaging and HP Indigo Pack Ready workflows.
HP Indigo Pack ReadyMetalized BOPET ReadyLam
A metalized BOPET laminating film engineered for flexible packaging and digital print applications. The BOPET base is plasma treated to enhance aluminum adhesion and barrier properties, while the thermal active polymer is designed to improve bonding with HP Indigo digital printing jobs.
- Good aluminum adhesion and barrier properties
- Strong adhesive force with digital print jobs
- Excellent resistance to tear and elongation
- Improved peel strength and ink anchorage
- No drying or curing required after lamination
- Lower-temperature process supports production efficiency
Designed for use with HP Indigo digital press output, including 20000 / 6800 class workflows, for Pack Ready flexible-packaging production.
Built for Digital Flexible Packaging
Metalized BOPET ReadyLam combines a reflective packaging surface with improved digital-print bonding and an efficient thermal-lamination workflow.
- Plasma-treated metalized BOPET base
- Enhanced aluminum adhesion and barrier properties
- Improved bond strength with HP Indigo print jobs
- Helps reduce foaming and stripping after die-cutting
- No post-lamination drying or curing step
- Designed for printing and flexible-packaging applications
Need Help With Metalized BOPET ReadyLam?
Contact KDX America for technical data, roll specifications, HP Indigo compatibility, and flexible-packaging recommendations.