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Heat-Sealable Flexible Packaging Film

Sealable BOPP ReadyLam.

Heat-sealable BOPP ReadyLam engineered for HP Indigo digital flexible-packaging workflows, combining high hot-tack and seal strength with strong digital-print bonding and efficient high-speed converting.

Sealable BOPPHP IndigoPack ReadyHigh Hot-TackFlexible Packaging
Heat-Sealable SurfaceOne side is designed for heat sealing with high hot-tack and seal strength.
Enhanced Digital BondingThermal-active polymer improves peel strength and ink anchorage with HP Indigo output.
High-Speed MachinabilityExcellent slip and converting performance support efficient flexible-packaging production.
ReadyLam / Packaging Film

Sealable BOPP ReadyLam

Heat-sealable BOPP construction for digitally printed flexible packaging and HP Indigo Pack Ready workflows.

HP Indigo Pack Ready 2-Sided ReadyLam Construction HEAT-SEALABLE BOPP THERMAL ACTIVE POLYMER Seal strength • Hot tack • HP Indigo bonding READYLAM SEALABLE BOPP HIGH HOT-TACK Flexible Packaging
Heat-Sealable BOPP Flexible Packaging Film

Sealable BOPP ReadyLam

A heat-sealable BOPP laminating film with a sealable surface on one side and a thermal-active polymer on the other. The construction is designed to combine very high hot-tack and seal strength with strong bonding to HP Indigo digital printing jobs and dependable high-speed machinability.

  • Very high hot-tack and seal strength
  • Excellent slip properties
  • Excellent machinability on high-speed equipment
  • Good optical properties
  • Stronger bonding with HP Indigo digital print jobs
  • No drying or curing required after lamination
Product Structure
Heat-Sealable BOPPSealable packaging surface
Thermal Active PolymerDigital-print bonding surface
ApplicationsHP Indigo Pack Ready flexible packaging, heat-sealable printed packaging, pouching applications, digitally printed packaging films, and other short-run converting workflows.
Temperature90–180°C
Pressure8–18 MPa
Speed10–70 m/min
Packaging Workflow Benefits

Built for Heat-Sealable Digital Packaging

Sealable BOPP ReadyLam combines packaging sealability with enhanced digital-print adhesion and efficient thermal-lamination processing.

  • Strong hot-tack performance for heat-sealing applications
  • Enhanced peel strength with HP Indigo print jobs
  • Better ink anchorage than ordinary BOPP ReadyLam
  • Helps reduce foaming and stripping after die-cutting
  • No post-lamination drying or curing step
  • Designed for printing and flexible-packaging applications
Core Product Advantage
HighHot-Tack & Seal Strength

The sealable BOPP surface is engineered for strong packaging seals while the opposite thermal-active polymer layer provides the digital-print bond required for Pack Ready workflows.

Need Help With Sealable BOPP ReadyLam?

Contact KDX America for technical data, roll specifications, HP Indigo compatibility, and heat-sealable flexible-packaging recommendations.

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