Sealable Metalized BOPP ReadyLam.

Heat-sealable metalized BOPP ReadyLam for HP Indigo digital flexible-packaging workflows, combining strong barrier performance, high hot-tack and seal strength, and enhanced bonding to digitally printed packaging.

Metalized BOPPHeat SealableHP IndigoPack ReadyHFFS / VFFSBarrier Film

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Metalized Barrier PerformancePlasma-treated BOPP supports strong aluminum adhesion and barrier properties.

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High Hot-Tack & Seal StrengthHeat-sealable surface is designed for dependable flexible-packaging seals.

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HFFS / VFFS CompatibleDesigned for use in horizontal and vertical form-fill-seal packaging systems.

ReadyLam / Packaging Film

Sealable Metalized BOPP ReadyLam

Heat-sealable metalized BOPP construction for digitally printed flexible packaging and high-speed form-fill-seal applications.

HP Indigo Pack Ready

Sealable Metalized Flexible Packaging Film

Sealable Metalized BOPP ReadyLam

A sealable metalized BOPP laminating film with a heat-sealable surface on one side and a thermal-active polymer on the other. The metalized BOPP base is plasma treated to improve aluminum adhesion and barrier performance, while the thermal-active polymer increases bonding strength with HP Indigo digital print output.

Good aluminum adhesion and barrier properties
Very high hot-tack and seal strength
Strong adhesive force with digital print jobs
Excellent machinability on high-speed equipment
Compatible with HFFS and VFFS packaging machines
No drying or curing required after lamination

Product Structure

Sealable Metalized BOPPBarrier and heat-sealable packaging layer

Thermal Active PolymerHP Indigo digital-print bonding layer

ApplicationsHP Indigo Pack Ready flexible packaging, HFFS/VFFS packaging, heat-sealable pouches, digital packaging films, snacks, food packaging, household products, and other high-barrier short-run packaging applications.

Temperature90–180°C

Pressure8–18 MPa

Speed10–70 m/min

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Packaging Workflow Benefits

Barrier, Sealability & Digital Bonding

This construction combines three important packaging requirements in one ReadyLam solution: metalized barrier performance, heat-sealing capability, and strong adhesion to digitally printed output.

Plasma-treated metalized BOPP for improved aluminum adhesion
Strong barrier properties for flexible-packaging applications
Improved peel strength with HP Indigo digital printing jobs
Better ink anchorage than ordinary BOPP ReadyLam
Helps reduce foaming and stripping after die-cutting
Supports immediate time to market after lamination

Packaging Equipment Compatibility

Built for Form-Fill-Seal Workflows

HFFSVFFSHigh-Speed Converting

The sealable metalized construction is designed for flexible-packaging production where barrier performance and dependable heat seals must carry through high-speed horizontal or vertical form-fill-seal equipment.

Need Help With Sealable Metalized BOPP ReadyLam?

Contact KDX America for technical data, roll specifications, HP Indigo compatibility, HFFS/VFFS guidance, and flexible-packaging recommendations.

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